![]() An example of thermal tape is the stuff you see pre-applied to alot of heat sinks. So at a guess hes not suggesting thermal paste but rather some kind of thermal tape/pad. This is why it comes pre-applied to alot of coolers, you would have to go out of your way to remove it.īy not using thermal paste your friend would have alot of trouble with processors overheating and I doubt he would get much business if anyone found out. Most cpus will overheat without some kind of thermal compound. I would recommend that you apply this principle - DO NOT let your friend within 1 Meter of your new computer!!!! We have a taped off 1 meter distance from the Satelite instrument to keep "un-informed" people from getting to close. If Pure silver then the "suspension" prevents conductivity. If it is a compound then it is non-conductive. Not positive, but I don't believe AS5 is conductive, The Silver is in a suspension, and also not sure if it is Pure silver, or a silver compound. My use of reduces could be replaced with prevents, But some my argue, nothing is 100% This is caused when two dissimilar metals are in contact with each other - when heated this process is excellerated. ![]() (2) It reduces electrochemical (galvanic) action between the CPU and the Heat sink. As pointed out there are "spots" that are not in perfect contact, while the Paste fills these gaps and improves thermo conductivity, it also prevents oxidation. (1) It reduces oxidation which inhibits the transfer of heat. Here are two points not normally mentioned Previous post have stated why you shoud use the thermo paste. Maybe he isn't comfortable applying it correctly himself I don't know but as I mentioned I would class it as a critical part in a whole process of ensuring a cool and healthy system. Obviously are friend has a different opinion on the use of thermal paste but I would say its largely unfounded. This is the method I would recommend if you aren't sure. The pressure from the heatsink once it has been locked in place does the job of spreading the compound for you and you tend to achieve a fairly even spread. Then install the heatsink attempting to keep it all level to ensure an even spread. Why take the risk? As I said the chances of you damaging components is slim to none if you apply it correctly.Ī popular method which you may feel more comfortable to use is to apply a small amount of compound roughly the size of a small pea or a grain of rice to the center of the CPU base. but in my opinion there is absolutely no plausible reason not to do so. There are some people who will say that you don't need thermal paste etc. Case airflow also falls into this bracket since a heatsink will never dissipate heat effectively if the air around the heatsink is warm. In my opinion thermal paste is part of a whole range of procedures which together contribute to a cool-running system. ![]() However, the risk of this is miniscule if the thermal paste is properly applied which isn't difficult to do. Obviously metals also conduct electricity and so can short out components on the motherboard if it does seep over. This mainly comes down to the fact that some makes of thermal paste use metal compounds in their paste since metal is a better thermal conductor. There is a risk of damage to the motherboard from excess use of thermal compound. The heatsink is obviously designed to dissipate heat from the CPU itself so the better the contact between the CPU and the heatsink the more heat will be dissipated and the cooler the CPU. It attempts to compensate for irregularities between the two surfaces - tiny microscopic bumps or ridges which may hinder proper thermal conductivity between the two surfaces. Thermal paste is intended to increase the thermal conductivity between the surfaces of both the CPU heatspreader and the heatsink itself. ![]()
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